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On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the 2025 Industry Exchange Conference of Suzhou Nano City as a special guest, discussing topics on the challenges and breakthroughs of tech-innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the 2025 Industry Exchange Conference of Suzhou Nano City as a special guest, discussing topics on the challenges and breakthroughs of tech-innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the 2025 Industry Exchange Conference of Suzhou Nano City as a special guest, discussing topics on the challenges and breakthroughs of tech-innovation enterprises.

At the event site, Liu Bo, centering on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics," addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration." He also delivered a brilliant sharing on breaking through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

In 2024, the cumulative shipment volume of Xizhi Technology's self-developed SiC DCM plastic-encapsulated power modules exceeded 30,000 units, with product performance far surpassing domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM plastic-encapsulated power modules had a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its excellent performance in 2024, Xizhi Technology successfully distinguished itself and won the "Leap Achievement Award." At the event site, Liu Bo, focusing on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics," addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration." He also delivered a brilliant sharing on breaking through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology's self-developed SiC DCM plastic-encapsulated power modules had a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its excellent performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM plastic-encapsulated power modules had a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its excellent performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event site, Liu Bo, centering on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics," addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration." He also delivered a brilliant sharing on breaking through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology's self-developed SiC DCM plastic-encapsulated power modules had a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its excellent performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM plastic-encapsulated power modules had a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its excellent performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event site, Liu Bo, centering on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics," addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration." He also delivered a brilliant sharing on breaking through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

At the event site, Liu Bo, centering on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics," addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration." He also delivered a brilliant sharing on breaking through in 2025 by enhancing value discovery capabilities and value innovation efficiency.