Automotive Industry

System loop inductance <16nH, Tjmax=175°C, 8 parallel chips output >650Arms

Ultra-low loop inductance, lower voltage spikes

Smaller parasitic resistance

Balanced dynamic current sharing

Lower common-mode voltage

Si3N4 substrate & pin-fin cooling structure results in lower thermal resistance

Maximum operating junction temperature 175°C

Ultra-low loop inductance, lower voltage spikes

Si3N4 substrate & pin-fin cooling structure enable lower thermal resistance

Maximum operating junction temperature 200°C

Integrated water channel thermal design

More compact structure, higher power density

Six-in-one design, smaller size, easier assembly

Terminal laser welding, low system stray inductance

Plastic-sealed half-bridge welding heatsink, low thermal resistance

Compact design, high power density

Plastic-sealed design, high reliability

Six-in-one design, flexible system application

High-reliability packaging technology

Peak efficiency up to 98%

Maximum continuous output power 1kW

Power density up to 5140 W/in³

Supports bidirectional startup and steady-state operation

Supports 60A continuous output current and 120A transient current during buck operation

• 60A continuous

• 120A transient, up to 2ms

Supports 15A continuous output current and 30A transient current during boost operation

• 15A continuous

• 30A transient, up to 2ms

Supports multi-module parallel operation

Supports over/under voltage, overcurrent, short circuit, and over-temperature protection

Advanced high-frequency technology

Peak efficiency up to 96.2%, weighted average efficiency up to 95%

Power density up to 12.5kW/L

Maximum continuous output current: 230A

Maximum continuous output power: 3kW

Advanced shell sealing technology

Extremely low module height

Extremely low downward thermal resistance

Supports multi-module parallel connection

Supports pre-charge, over/under voltage, overcurrent, short circuit, and over-temperature protection