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On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the Suzhou Nano City 2025 Industrial Exchange Conference as a special guest, discussing topics on the challenges and breakthroughs for sci-tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the Suzhou Nano City 2025 Industrial Exchange Conference as a special guest, discussing topics on the challenges and breakthroughs for sci-tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the Suzhou Nano City 2025 Industrial Exchange Conference as a special guest, discussing topics on the challenges and breakthroughs for sci-tech innovation enterprises.

At the event, Liu Bo gave a wonderful sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics.” By adopting the approach of “optimizing talent, setting direction, strengthening investment, and rapid iteration,” he addressed the challenges of 2024 and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

In 2024, Xizhi Technology’s self-developed SiC DCM molded power module achieved a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology stood out and was awarded the “Leap Achievement Award.” In 2024, Xizhi Technology’s self-developed SiC DCM molded power module achieved a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology stood out and was awarded the “Leap Achievement Award.” At the event, Liu Bo gave a wonderful sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics.” By adopting the approach of “optimizing talent, setting direction, strengthening investment, and rapid iteration,” he addressed the challenges of 2024 and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology’s self-developed SiC DCM molded power module achieved a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology stood out and was awarded the “Leap Achievement Award.” In 2024, Xizhi Technology’s self-developed SiC DCM molded power module achieved a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology stood out and was awarded the “Leap Achievement Award.” At the event, Liu Bo gave a wonderful sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics.” By adopting the approach of “optimizing talent, setting direction, strengthening investment, and rapid iteration,” he addressed the challenges of 2024 and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology’s self-developed SiC DCM molded power module achieved a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology stood out and was awarded the “Leap Achievement Award.” In 2024, Xizhi Technology’s self-developed SiC DCM molded power module achieved a cumulative shipment volume exceeding 30,000 units, and the product performance far surpassed domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology stood out and was awarded the “Leap Achievement Award.” At the event, Liu Bo gave a wonderful sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide-bandgap semiconductors and high-frequency power electronics.” By adopting the approach of “optimizing talent, setting direction, strengthening investment, and rapid iteration,” he addressed the challenges of 2024 and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.