On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the 2025 Industry Exchange Conference at Suzhou Nano City as a special guest, discussing topics on the challenges and breakthroughs of sci-tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the 2025 Industry Exchange Conference at Suzhou Nano City as a special guest, discussing topics on the challenges and breakthroughs of sci-tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the 2025 Industry Exchange Conference at Suzhou Nano City as a special guest, discussing topics on the challenges and breakthroughs of sci-tech innovation enterprises.

At the event, Liu Bo delivered a brilliant sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics.” He addressed the challenges of 2024 through “optimizing talent, setting direction, strengthening investment, and fast iteration,” and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

In 2024, Xizhi Technology’s self-developed SiC DCM molded power module accumulated shipments exceeding 30,000 units, and its product performance far surpassed domestic and international competitors. With its excellent performance in 2024, Xizhi Technology stood out and won the “Leap Achievement Award.” In 2024, Xizhi Technology’s self-developed SiC DCM molded power module accumulated shipments exceeding 30,000 units, and its product performance far surpassed domestic and international competitors. With its excellent performance in 2024, Xizhi Technology stood out and won the “Leap Achievement Award.” At the event, Liu Bo delivered a brilliant sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics.” He addressed the challenges of 2024 through “optimizing talent, setting direction, strengthening investment, and fast iteration,” and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology’s self-developed SiC DCM molded power module accumulated shipments exceeding 30,000 units, and its product performance far surpassed domestic and international competitors. With its excellent performance in 2024, Xizhi Technology stood out and won the “Leap Achievement Award.” In 2024, Xizhi Technology’s self-developed SiC DCM molded power module accumulated shipments exceeding 30,000 units, and its product performance far surpassed domestic and international competitors. With its excellent performance in 2024, Xizhi Technology stood out and won the “Leap Achievement Award.” At the event, Liu Bo delivered a brilliant sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics.” He addressed the challenges of 2024 through “optimizing talent, setting direction, strengthening investment, and fast iteration,” and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology’s self-developed SiC DCM molded power module accumulated shipments exceeding 30,000 units, and its product performance far surpassed domestic and international competitors. With its excellent performance in 2024, Xizhi Technology stood out and won the “Leap Achievement Award.” In 2024, Xizhi Technology’s self-developed SiC DCM molded power module accumulated shipments exceeding 30,000 units, and its product performance far surpassed domestic and international competitors. With its excellent performance in 2024, Xizhi Technology stood out and won the “Leap Achievement Award.” At the event, Liu Bo delivered a brilliant sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics.” He addressed the challenges of 2024 through “optimizing talent, setting direction, strengthening investment, and fast iteration,” and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

At the event, Liu Bo delivered a brilliant sharing centered on the positioning of “Innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics.” He addressed the challenges of 2024 through “optimizing talent, setting direction, strengthening investment, and fast iteration,” and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.