Nobel Laureate Joins Cloud Origin Launch Event Grandly Opens

On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the Suzhou Nano City 2025 Industry Exchange as a special guest, discussing topics on the challenges and breakthroughs for tech startups. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the Suzhou Nano City 2025 Industry Exchange as a special guest, discussing topics on the challenges and breakthroughs for tech startups. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended the roundtable forum of the Suzhou Nano City 2025 Industry Exchange as a special guest, discussing topics on the challenges and breakthroughs for tech startups.

At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strong investment, and rapid iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

In 2024, the cumulative shipment volume of Xizhi Technology's self-developed SiC DCM molded power modules exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power modules cumulative shipment volume exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strong investment, and rapid iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology's self-developed SiC DCM molded power modules cumulative shipment volume exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power modules cumulative shipment volume exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strong investment, and rapid iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology's self-developed SiC DCM molded power modules cumulative shipment volume exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power modules cumulative shipment volume exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strong investment, and rapid iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strong investment, and rapid iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.