Nobel Laureate Joins Cloud Qiyuan Launch Event Grandly Opens

On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the 2025 Industry Exchange Conference at Suzhou Nano City, discussing topics on challenges and breakthroughs for sci-tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the 2025 Industry Exchange Conference at Suzhou Nano City, discussing topics on challenges and breakthroughs for sci-tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the 2025 Industry Exchange Conference at Suzhou Nano City, discussing topics on challenges and breakthroughs for sci-tech innovation enterprises.

At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization of wide-bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipment exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipment exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization of wide-bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipment exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipment exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization of wide-bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipment exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipment exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization of wide-bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

At the event, Liu Bo delivered a brilliant sharing around the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization of wide-bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and aimed to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.