Nobel Laureate Joins Cloud Qiyuan Launch Event Grandly Opens

On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the Suzhou Nano City 2025 Industry Exchange Conference, discussing topics on the challenges and breakthroughs for sci-tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the Suzhou Nano City 2025 Industry Exchange Conference, discussing topics on the challenges and breakthroughs for sci-tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the Suzhou Nano City 2025 Industry Exchange Conference, discussing topics on the challenges and breakthroughs for sci-tech innovation enterprises.

At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, with product performance far surpassing domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leaping Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, with product performance far surpassing domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leaping Achievement Award." At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, with product performance far surpassing domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leaping Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, with product performance far surpassing domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leaping Achievement Award." At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency. In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, with product performance far surpassing domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leaping Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, with product performance far surpassing domestic and international competitors. With its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leaping Achievement Award." At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.

At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovating high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." He addressed the challenges of 2024 through "optimizing talent, setting direction, strengthening investment, and fast iteration," and planned to break through in 2025 by enhancing value discovery capabilities and value innovation efficiency.