Nobel Laureate Joins Cloud Qiyuan Launch Ceremony Grand Opening

On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the Suzhou Nano City 2025 Industrial Exchange Conference, discussing topics on the challenges and breakthroughs for tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the Suzhou Nano City 2025 Industrial Exchange Conference, discussing topics on the challenges and breakthroughs for tech innovation enterprises. On January 8, 2025, Liu Bo, CEO of Xizhi Technology, attended as a special guest the roundtable forum of the Suzhou Nano City 2025 Industrial Exchange Conference, discussing topics on the challenges and breakthroughs for tech innovation enterprises.

At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovative high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." By adopting the approach of "optimizing talent, setting direction, strengthening investment, and rapid iteration," he addressed the challenges of 2024, and through enhancing value discovery capabilities and value innovation efficiency, he aimed to achieve breakthroughs in 2025.

In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovative high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." By adopting the approach of "optimizing talent, setting direction, strengthening investment, and rapid iteration," he addressed the challenges of 2024, and through enhancing value discovery capabilities and value innovation efficiency, he aimed to achieve breakthroughs in 2025. In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovative high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." By adopting the approach of "optimizing talent, setting direction, strengthening investment, and rapid iteration," he addressed the challenges of 2024, and through enhancing value discovery capabilities and value innovation efficiency, he aimed to achieve breakthroughs in 2025. In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." In 2024, Xizhi Technology's self-developed SiC DCM molded power module cumulative shipments exceeded 30,000 units, and the product performance far surpassed domestic and international competitors. Relying on its outstanding performance in 2024, Xizhi Technology successfully stood out and won the "Leap Achievement Award." At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovative high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." By adopting the approach of "optimizing talent, setting direction, strengthening investment, and rapid iteration," he addressed the challenges of 2024, and through enhancing value discovery capabilities and value innovation efficiency, he aimed to achieve breakthroughs in 2025.

At the event, Liu Bo delivered a brilliant sharing centered on the positioning of "innovative high-frequency, packaging, and chip technologies, redefining power electronics products, and accelerating the globalization process of wide bandgap semiconductors and high-frequency power electronics." By adopting the approach of "optimizing talent, setting direction, strengthening investment, and rapid iteration," he addressed the challenges of 2024, and through enhancing value discovery capabilities and value innovation efficiency, he aimed to achieve breakthroughs in 2025.